Requirement for robust capacitors in high density power converters

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn 1, Issue , 2001, Pages 14-21

  Clelland, I W ^a   Price, R A ^a  

^a ITW Paktron   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITORS; INTEGRATED CIRCUIT LAYOUT; MICROPROCESSOR CHIPS; MULTILAYERS; POWER SUPPLY CIRCUITS;

MULTILAYER POLYMER (MLP) CHIP CAPACITORS;

POWER CONVERTERS;

EID: 0035063608     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Capacitor insulation
2. Capacitor fundamentals
3. Tantalum ultra-low ESR developments for SMPS applications
4. Board flexure comparison between surface mount multi-layer ceramic and film capacitors
5. Advances in "low-fire" dielectric technology for the manufacture of MLCC and comparison with base metal electrode technology