Numerical optimization of a power electronics cooling assembly

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn 2, Issue , 2001, Pages 1068-1073

  Xiong, G ^a   Lu, M ^a   Chen, C L ^a   Wang, B P ^a   Kehl, D ^a  

^a ROCKWELL SCIENCE CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COOLING SYSTEMS; DATABASE SYSTEMS; ENERGY DISSIPATION; HEAT SINKS; HIGH TEMPERATURE EFFECTS; NONLINEAR SYSTEMS; NUMERICAL METHODS;

FAN-SINK AIR-COOLING SYSTEMS; POWER ELECTRONIC DEVICES;

POWER ELECTRONICS;

EID: 0035058707     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. System-level modeling of a compact, high efficiency cooling device for the PA8000 processor
2. Optimizing the integration of an electronics system into an existing enclosure using CFD modeling techniques
3. Optimizing thermal performance for design of advanced power electronics assembly
4. A new response surface method for design optimization
5. Surface generated by moving least square methods
6. Thermal analysis design tool for parallel plate heatsinks