Increased lifetime of wire bonding connections for IGBT power modules

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn 2, Issue , 2001, Pages 1040-1044

  Hamidi, A ^a   Kaufmann, S ^a   Herr, E ^a  

^a ABB CORPORATE RESEARCH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COATINGS; FATIGUE OF MATERIALS; INSULATED GATE BIPOLAR TRANSISTORS; MULTICHIP MODULES; PRINTED CIRCUIT DESIGN; RELIABILITY; THERMAL EXPANSION;

WIRE BONDING CONNECTIONS;

ELECTRONICS PACKAGING;

EID: 0035058706     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Investigations on the damage mechanism of aluminum wire bonds used for high power applications
2. Fast power cycling test for IGBT modules in traction applications
3. Reliability of high power IGBT modules - Testing on thermal fatigue effects due to traction cycles
4. Reliability and lifetime evaluation of different wire bonding technologies for high power IGBT modules