Plasma etching of quartz for the fabrication of alternating aperture Phase Shift Photomasks: Etch rate uniformity study utilizing a Next Generation ICP Source

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4186, Issue , 2001, Pages 316-324

  Westerman, R ^a   Constantine, C ^a   Plumhoff, J ^a   Strawn, C ^a  

^a Unaxis USA Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHROMIUM; DRY ETCHING; INDUCTIVELY COUPLED PLASMA; OPTICAL RESOLVING POWER; PHOTOLITHOGRAPHY; PLASMA ETCHING; QUARTZ; SCANNING ELECTRON MICROSCOPY;

PHASE SHIFT PHOTOMASKS;

MASKS;

EID: 0035043085     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.410708     Document Type: Conference Paper

References (5)

1. Practical applications of IDEAL exposure method
2. Thin films for phase-shift masks
3. Integration of optical proximity correction strategies in strong phase shifters design for poly-gate layers
4. ICP quartz etch uniformity improvement for phase shift mask fabrication
5. The many challenges of oxide etching