Localized resist heating due to electron-beam patterning during photomask fabrication

Proceedings of SPIE- The International Society for Optical Engineering

Volumn 4186, Issue , 2001, Pages 482-493

  Wei, A C ^a   Beckman, W A ^a   Engelstad, R L ^a   Mitchell, J W ^a   Phung, T ^a   Zheng, J F ^a  

^a UNIVERSITY OF WISCONSIN MADISON   (United States)

Author keywords

e beam patterning; Optical lithography; Optical reticles; Thermomechanical analysis

Indexed keywords

COMPUTER SIMULATION; ELECTRON BEAM LITHOGRAPHY; ERROR ANALYSIS; FINITE ELEMENT METHOD; PHOTORESISTS; THERMAL EFFECTS; THERMOMECHANICAL TREATMENT;

ELECTRON BEAM PATTERNING; LOCALIZED RESIST HEATING EFFECTS; OPTICAL RETICLES;

MASKS;

EID: 0035043045     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.410727     Document Type: Article

References (16)

1. Measurement of resist heating in photomask fabrication
2. Resist heating effect on 50 keV EB mask writing
3. Theory of beam-induced substrate heating
4. Thermal effects in high voltage e-beam lithography
5. Temperature effects on positive electron resists irradiated with electron beam and deep-UV light
6. Resist heating effects in 25 and 50 kV e-beam lithography on glass masks
7. Thermal distribution and the effect on resist sensitivity in electron-beam direct write
8. Resist heating effect in direct electron beam writing
9. Experimental investigation of the resist heating effect in a variably shaped EBL system
10. Resist heating with different writing strategies for high-throughput maskmaking
11. Quantitative measurement of the resist heating in a variable shaped electron lithography
12. Simulation and measurement of resist heating in multipass exposure using a 50 kV variably shaped beam system
13. Experimental verification of the TEMPTATION (Temperature Simulation) software tool