Impact of wafer surface profile on IC packaging

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2001, Pages 405-412

  Wu, J C L ^a   Iksan, H ^a   Huang, T J ^a   Wu, J D ^a   Lo, K ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Adhesion; CTE; Delamination; FTIR; Passivation; Profile; Topography

Indexed keywords

ATOMIC FORCE MICROSCOPY; DEPOSITION; FOURIER TRANSFORM INFRARED SPECTROSCOPY; PASSIVATION; PLASTIC MOLDS; WSI CIRCUITS;

PLASTIC QUAD FLAT PACKAGES (PQFP); WAFER SURFACE PROFILES;

CHIP SCALE PACKAGES;

EID: 0035023773     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)