A micromachining post-process module with pattern transfer in deep cavities for RF silicon technology

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2001, Pages 345-348

  Pham, N P ^a   Sarro, P M ^a   Ng, K T ^a   Burghartz, J N ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

CROSSTALK; ELECTRIC INDUCTORS; ETCHING; MICROMACHINING; OPTIMIZATION; PATTERN MATCHING; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS;

SILICON TECHNOLOGY;

RADIO EQUIPMENT;

EID: 0035020750     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)