SCOPUS 정보 검색 플랫폼

International Journal of Adhesion and Adhesives

Volumn 21, Issue 3, 2001, Pages 233-239

Cure-adhesion of rubber to electroless Pd-P alloy deposit: Effect of P content in alloy

(9) Ikeda, Yoshiyuki a Nawafune, Hidemi a Mizumoto, Shozo a Sasaki, Muneo a Nagatani, Asahiro b Nishimori, Akihito b Yamaguchi, Koichi b Uchida, Ei c Okada, Takashi c

a KONAN UNIVERSITY (Japan)

b Hyogo Prefectural Institute of Industrial Research Technical Center for Machinery and Metals (Japan)

c Ishihara Chemical Co Ltd (Japan)

Author keywords

Adhesion strength; Bonding interface; C. X ray photoelectron spectroscopy; Cure adhesion; Electroless Plating; Natural rubber; Palladium; Palladium alloy; Rutherford backscattering spectroscopy; Solderability

Indexed keywords

ADHESION; CURING; DURABILITY; ELECTROPLATING; FAILURE ANALYSIS; INTERFACES (MATERIALS); PALLADIUM COMPOUNDS; RUTHERFORD BACKSCATTERING SPECTROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

ELECTROLESS PLATING;

RUBBER BASE ADHESIVES;

EID: 0034982930 PISSN: 01437496 EISSN: None Source Type: Journal
DOI: 10.1016/S0143-7496(01)00007-0 Document Type: Article

Times cited : (4)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.