Thermal signature for solder defect detection using a neural network approach

Proceedings of SPIE-The International Society for Optical Engineering

Volumn 4360, Issue , 2001, Pages 636-643

  Hsieh, Sheng Jen ^a   Calderon, Agapito ^b  

^a TEXAS A AND M UNIVERSITY   (United States)

^b UNIVERSITY OF TEXAS PAN AMERICAN   (United States)

Author keywords

Neural network; Printed circuit board; Solder defect; Thermal signature

Indexed keywords

ALGORITHMS; BACKPROPAGATION; BASIC (PROGRAMMING LANGUAGE); COMPUTER PROGRAMMING; DATA REDUCTION; DEFECTS; FEEDBACK CONTROL; INFRARED IMAGING; MICE (COMPUTER PERIPHERALS); PRINTED CIRCUIT BOARDS; SOLDERING; STATISTICAL METHODS;

SOLDER DEFECTS; THERMAL SIGNATURES;

MULTILAYER NEURAL NETWORKS;

EID: 0034941621     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.421049     Document Type: Article

References (7)

1. X-ray inspection systems
2. Automatic PCB inspection systems
3. Automated thermographic inspection of surface mount solder joints
4. Infrared solder joint inspection on surface mount printed circuit boards
5. Automated inspection of solder joints- A neural network approach
6. Solder joint inspection using air stimulation speckle vibration detection method and fluorescence detection method
7. Understanding automated X-ray inspection