Thermal packaging of piggyback VCSELs for GBd optical communications modules

Proceedings of SPIE-The International Society for Optical Engineering

Volumn 4290, Issue , 2001, Pages 163-168

  Simon, Jonathan ^a   Giboney, Kirk ^a   Buckman, Lisa ^a  

^a AGILENT TECHNOLOGIES   (United States)

Author keywords

Communications; Flip chip; Optoelectronic; Parallel optics; Piggyback; VCSEL

Indexed keywords

ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; OPTICAL COMMUNICATION EQUIPMENT; OPTICAL INTERCONNECTS; SURFACE MOUNT TECHNOLOGY; THERMOGRAPHY (IMAGING); TRANSMITTERS;

THERMAL PACKAGING; VERTICAL CAVITY SURFACE EMITTING LASERS (VCSEL);

SEMICONDUCTOR LASERS;

EID: 0034935368     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.426914     Document Type: Article

References (3)

1. The PONI-1 parallel-optical link