Evaluation of Thin Agar Layer method for recovery of heat-injured foodborne pathogens

Journal of Food Science

Volumn 66, Issue 4, 2001, Pages 580-583

  Wu, V C H ^a   Fung, D Y C ^a  

^a KANSAS STATE UNIVERSITY   (United States)

Author keywords

Heat injured foodborne pathogens; Thin agar layer

Indexed keywords

ANALYTIC METHOD; CULTURE MEDIUM; FOOD SAFETY; FOODBORNE PATHOGEN; GENETIC STRAIN; HEAT TREATMENT; SPECIFICITY; TEMPERATURE; THIN AGAR LAYER;

ESCHERICHIA COLI; LISTERIA MONOCYTOGENES; SALMONELLA TYPHIMURIUM; STAPHYLOCOCCUS AUREUS; TYPHIMURIUM; YERSINIA ENTEROCOLITICA;

EID: 0034933681     PISSN: 00221147     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1365-2621.2001.tb04605.x     Document Type: Article

References (10)

1. Evaluation of various medium for recovery of thermally-injured Escherichia coli O157:H7
2. Preliminary foodnet data on the incidence of foodborne illnesses
3. Development and testing of 202 agar for the detection of Escherichia coli O157:H7
4. Violet red bile 2 agar for stressed coliforms
5. Sublethal injured makes Gram-negative and resistant Gram-positive bacteria sensitive to the bacteriocins, pediocin AcH and nisin
6. Overlay method for recovery of heat-or acid-injured Listeria monocytogenes and Salmonella typhimurium
7. Application of thin agar layer method for recovery of injured Salmonella typhimurium
8. Repair and enumeration of injured coliforms by a plating procedure