Molecular dynamics simulation of microcrack healing in copper

Computational Materials Science

Volumn 20, Issue 2, 2001, Pages 143-150

  Li, S ^a   Gao, K W ^a   Qiao, L J ^a   Zhou, F X ^b   Chu, W Y ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

^b INSTITUTE OF MECHANICS   (China)

Author keywords

Cu; Dislocation; Microcrack healing; Molecular dynamics simulation

Indexed keywords

ADDITION REACTIONS; COMPRESSIVE STRESS; COMPUTER SIMULATION; DISLOCATIONS (CRYSTALS); MICROCRACKS; MOLECULAR DYNAMICS;

MICROCRACK HEALING;

COPPER;

EID: 0034912664     PISSN: 09270256     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0927-0256(00)00130-0     Document Type: Article

References (18)

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