|
Volumn 17, Issue 5, 2001, Pages 203-214
|
Effect of ethylene glycol addition on copper electrodeposition using rotating cylinder electrode
a a a |
Author keywords
Electrodeposition of copper; Ethylene glycol; SEM
|
Indexed keywords
COPPER;
COPPER SULFATE;
ETHYLENE GLYCOL;
ARTICLE;
ELECTROCHEMISTRY;
ELECTRODE;
METAL INDUSTRY;
METALLURGY;
SCANNING ELECTRON MICROSCOPY;
SURFACE PROPERTY;
|
EID: 0034901861
PISSN: 02561654
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
Times cited : (2)
|
References (18)
|