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Volumn 17, Issue 5, 2001, Pages 203-214

Effect of ethylene glycol addition on copper electrodeposition using rotating cylinder electrode

Author keywords

Electrodeposition of copper; Ethylene glycol; SEM

Indexed keywords

COPPER; COPPER SULFATE; ETHYLENE GLYCOL;

EID: 0034901861     PISSN: 02561654     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (2)

References (18)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.