The challenges of packaging MEMS components for the all optical networks of the future

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4408, Issue , 2001, Pages 19-27

  Scotti, R E ^a   Basavanhally, N ^a   Low, Y L ^a   Ramsey, D A ^a   Bishop, D J ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

MEMS; MOEMS; Photonic packaging

Indexed keywords

COST EFFECTIVENESS; CROSSTALK; DENSE WAVELENGTH DIVISION MULTIPLEXING; ELECTRONICS PACKAGING; INTEGRATED OPTOELECTRONICS; LIGHT AMPLIFIERS; LIGHT MODULATORS; NONLINEAR OPTICS; OPTICAL COMMUNICATION; OPTICAL INTERCONNECTS; OPTICAL SWITCHES; SEMICONDUCTOR LASERS; SINGLE MODE FIBERS;

OPTICAL SWITCHING MODULES (OSM); PHOTONIC PACKAGING;

MICROELECTROMECHANICAL DEVICES;

EID: 0034874557     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.425362     Document Type: Conference Paper

References (7)

1. Dynamic gain equalization of erbium-doped fiber amplifier with all-fiber acousto-optic tunable filters
2. Proposed WDM cross-connect using a planar arrangement of waveguide routers and phase shifters
3. A hitless reconfigurable add-drop multiplexer for WDM networks utilizing planar waveguides, thermo-optic switches, and UV-induced gratings
4. Fully provisioned 112x112 micromechanical optical cross-connect with 35.8 Tb/s demonstrated capacity
5. Reflective modulators and by-pass switches: Two MEMS components for fiber optic communications
6. Micromechanical fiber-optic attenuator with 3 μs response
7. Wavelength add-drop switching using tilting micromirrors