Cooling and power considerations for semiconductors into the next century

Proceedings of the International Symposium on Low Power Electronics and Design, Digest of Technical Papers

Volumn , Issue , 2001, Pages 100-105

  Belady, C ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; HEAT FLUX; MICROPROCESSOR CHIPS; REFRIGERATION; VAPORIZATION; VIBRATIONS (MECHANICAL);

PACKAGE LEVEL COOLING;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0034862298     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Liquid metal pastes for thermal connections
2. A survey of high-performance, high aspect ratio, air cooled heat sinks
3. Electricity used by office equipment and network equipment in the U.S.
4. Got a computer? More power to you