3D-CSP, an innovative packaging methods based on RMPD

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4407, Issue , 2001, Pages 180-184

  Bohlmann, H ^a   Gotzen R ^a   Reinhardt, A ^a  

^a MicroTEC Gesell Mikrotechnol mbH   (Germany)

Author keywords

3D CSP; Chip size packing; Microsystems; RMPD

Indexed keywords

ASPECT RATIO; MASKS; MICROSTRUCTURE; POLYMETHYL METHACRYLATES; SENSORS; SURFACE ROUGHNESS;

FLUIDIC STRUCTURES;

CHIP SCALE PACKAGES;

EID: 0034846924     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.425300     Document Type: Conference Paper

References (3)

1. Packaging-trends
2. Microsystems production with rapid micro product development (RMPD)