Cyanate-bismaleimide-epoxy resin compositions for flip chip, BGA and CSP pre-encapsulation

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4428, Issue , 2001, Pages 76-81

  Joon Lee, Y ^a   Lenos, H A ^a   Burress, R V ^a   Capote, M A ^a  

^a Aguila Technologies Inc   (United States)

Author keywords

CBE resin; Laminate; Laser drilling; Pre encapsulant; Screen printability

Indexed keywords

ENCAPSULATION; EPOXY RESINS; FABRICATION; LASER APPLICATIONS;

BALL GRID ARRAYS; LASER-DRILLING;

FLIP CHIP DEVICES;

EID: 0034838050     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

1. Cure behavior and thermal degradation mechanisms of epoxy and epoxy-cyanate resins
2. High performance polymers and composites
3. Electrical properties of cyanate ester resins and their significance for applications
4. Polycyanate esters: Science and applications
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6. Cyanate ester-cured epoxy resin structural composites
7. Effect of cyanate ester on the cure behavior and thermal stability of epoxy resin
8. NMR investigations of the possible cross reactions between cyanate and epoxy resins
9. Synthesis, characterization and properties of multifunctional napthalene-containing epoxy resins cured with cyanate ester
10. Influence of the stoichiometry of epoxy cyanate systems on molten state reactivity
11. Flip chip underfill characterization methods: Developing a test methodology for success in the harsh automotive environment
12. High performance no-flow underfills for low-cost flip-chip application: Material characterization