Accompanying the (re)design of products with environmental assessment (DfE) on the example of ADSM

IEEE International Symposium on Electronics and the Environment

Volumn , Issue , 2001, Pages 202-207

  Warburg, N ^a   Herrmann, C ^a   Chiodo, J D ^a  

^a UNIVERSITY OF STUTTGART   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COST BENEFIT ANALYSIS; ENVIRONMENTAL IMPACT; ENVIRONMENTAL PROTECTION; INTELLIGENT MATERIALS; PRODUCT DESIGN; PRODUCT DEVELOPMENT; SEMICONDUCTOR DEVICE MANUFACTURE; SHAPE MEMORY EFFECT; SUSTAINABLE DEVELOPMENT;

ACTIVE DISASSEMBLY USING SMART MATERIALS; ENVIRONMENTAL ASSESSMENT; LIFE CYCLE COSTING; SHAPE MEMORY POLYMERS;

ELECTRONICS INDUSTRY;

EID: 0034837194     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)