Electrical analysis of IC packaging with emphasis on different ball grid array packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 1496-1501

  Unchwaniwala, K B ^a   Caggiano, M F ^a  

^a RUTGERS UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC PROPERTIES; ELECTRONICS INDUSTRY; EQUIVALENT CIRCUITS; INTEGRATED CIRCUITS; SOLDERING;

BALL GRID ARRAY PACKAGES; ELECTRICAL PARAMETERS; INTEGRATED CIRCUIT PACKAGING;

ELECTRONICS PACKAGING;

EID: 0034836674     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. Advanced electronics packaging - With emphasis on multi chip module
2. Millimeter-wave flip-chip MMIC structure with high performance and high reliability interconnects
3. Comparison of electrical and thermal parameters of widebus SMD SSOP, TSSOP, TVSOP, and LFBGA packages
4. Wire bond measurements up to 20GHz - A starting point
5. Wire bond measurements up to 20GHz - A starting point
6. Solder joint reliability of BGA/CSP for mobile phones
7. Understanding and using surface mount technology and fine pitch technology
8. Packaging: More than a die holder
9. Ultra high speed GaAs MESFET IC modules using flip chip bonding