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Volumn , Issue , 2001, Pages 47-53
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A design and manufacturing solution for high-reliable, non-leaded CSP's like QFN
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Author keywords
[No Author keywords available]
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Indexed keywords
ENCAPSULATION;
INTEGRATED CIRCUIT LAYOUT;
INTEGRATED CIRCUIT MANUFACTURE;
PRODUCT DEVELOPMENT;
PRODUCTIVITY;
QUALITY CONTROL;
RELIABILITY;
DIRECT BOARD ATTACH METHOD;
MINIATURIZATION;
PACKAGE MANUFACTURABILITY;
CHIP SCALE PACKAGES;
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EID: 0034832835
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (2)
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References (2)
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