Binder system for micropowder injection molding

Materials Letters

Volumn 48, Issue 1, 2001, Pages 31-38

  Liu, Z Y ^a   Loh, N H ^a   Tor, S B ^a   Khor, K A ^a   Murakoshi, Y ^b   Maeda, R ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ACETAL RESINS; BINDERS; HIGH DENSITY POLYETHYLENES; PARAFFIN WAXES; POWDERS; STAINLESS STEEL;

ETHYLENE VINYL ACETATE; MICROPOWDER INJECTION MOLDING;

INJECTION MOLDING;

EID: 0034831527     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-577X(00)00276-7     Document Type: Article

References (12)

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