Optimization of the fan-heat sink systems in portable electronics environment

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4428, Issue , 2001, Pages 369-374

  Loh, C K ^a   Nelson, D ^a   Chou, D J ^a  

^a Enertron Inc   (United States)

Author keywords

Fan heat sink system; Gap length ratio; Optimization; Pressure drop; Thermal resistance

Indexed keywords

HEAT LOSSES; HEAT RESISTANCE; HEAT SINKS; HEAT TRANSFER COEFFICIENTS; OPTIMIZATION; PORTABLE EQUIPMENT; PRESSURE DROP; THERMAL LOAD;

FAN-HEAT SINK SYSTEM; PORTABLE ELECTRONICS; THERMAL MANAGEMENT SYSTEM;

ELECTRONICS PACKAGING;

EID: 0034829720     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. Enertron Inc. - Enertron's contribution the evolution of portable electronics cooling
2. Optimization of parallel plate heatsinks for forced convection
3. Fan-plus-heatsink "Optimization" - Mechanical and thermal design with reality
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5. Laminar flow forced convection in ducts
6. Analytic solutions for flow in tubes
7. Internal flow
8. Thermal behavior of solder-bonded and adhesive bonded folded fin assemblies
9. Calculating spreading resistance in heat sinks