Consideration of mechanical chip crack on FBGA packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 193-197

  Kiyono, S S ^a   Yonehara, K ^a   Graf, R S ^a   Howell, W J ^a  

^a IBM JAPAN LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; COSTS; CRACKS; ELECTRONIC EQUIPMENT; ELECTRONIC EQUIPMENT MANUFACTURE; TRANSFER MOLDING;

FINE PITCH PLASTIC BALL GRID ARRAY; PLASTIC BALL GRID ARRAY; SEMICONDUCTOR CHIPS; WIRE BOND;

ELECTRONICS PACKAGING;

EID: 0034828979     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)