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Volumn , Issue , 2001, Pages 1117-1121
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The impact of split power planes on package performance
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Author keywords
[No Author keywords available]
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Indexed keywords
APPLICATION SPECIFIC INTEGRATED CIRCUITS;
CAPACITANCE MEASUREMENT;
COMPUTER SIMULATION;
CROSSTALK;
ELECTRIC CURRENT MEASUREMENT;
ELECTRIC IMPEDANCE MEASUREMENT;
ELECTRIC POWER SUPPLIES TO APPARATUS;
ELECTRONIC EQUIPMENT TESTING;
SIGNAL NOISE MEASUREMENT;
THREE DIMENSIONAL;
TWO DIMENSIONAL;
CAPACITIVE COUPLING;
SPLIT POWER PLANES;
THREE DIMENSIONAL SIMULATION;
TRACE CROSSTALK;
TRACE IMPEDANCE;
TRANSIENT PLANE VOLTAGE;
TWO DIMENSIONAL SIMULATION;
ELECTRONICS PACKAGING;
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EID: 0034828432
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (8)
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References (2)
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