Cure kinetics and viscosity models for Hexcel 8552 epoxy resin

International SAMPE Symposium and Exhibition (Proceedings)

Volumn 46 II, Issue , 2001, Pages 2341-2354

  Hubert, P ^a   Johnston, A ^a   Poursartip, A ^a   Nelson, K ^a  

^a OLD DOMINION UNIVERSITY   (United States)

Author keywords

Cure kinetics; Degree of cure; Epoxy resin; Viscosity

Indexed keywords

CURING; DIFFERENTIAL SCANNING CALORIMETRY; DIFFUSION IN LIQUIDS; ELASTIC MODULI; GELATION; GLASS TRANSITION; MATHEMATICAL MODELS; REACTION KINETICS; SHRINKAGE; VISCOSITY OF LIQUIDS;

CURE KINETICS; DIFFUSION-CONTROLLED REACTIONS;

EPOXY RESINS;

EID: 0034828266     PISSN: 08910138     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)