Room temperature flip chip assembly of CdZnTe pixel detector arrays

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4428, Issue , 2001, Pages 331-334

  Riley, G A ^a   Bornstein, S ^a  

^a FlipChips Dot Com   (United States)

Author keywords

Cadmium zinc telluride; Detector arrays; Flip chip assembly; Low temperature adhesives; Pixel detectors; Pyroelectric film detectors

Indexed keywords

ADHESIVES; ASTROPHYSICS; CURING; FLIP CHIP DEVICES; GOLD; RADIATION DETECTORS; SEMICONDUCTING CADMIUM COMPOUNDS; STRESSES; TEMPERATURE;

CADMIUM ZINC TELLURIDE; FLIP CHIP ASSEMBLY; GOLD STUD BUMP FLIP CHIP ASSEMBLY; HIGH ALTITUDE BALLOON BORNE INSTRUMENTS; PIXEL DETECTOR ARRAYS; UNDERFILLS;

CHIP SCALE PACKAGES;

EID: 0034828183     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Silicon pixel detector for X-ray spectroscopy
2. Flip chip interconnection of detector arrays
3. Bump, dip, flip: Single chip