Multi-fiber-chip-coupling modules for monolithically integrated Mach-Zehnder interferometers for TDM/WDM communication systems

Conference on Optical Fiber Communication, Technical Digest Series

Volumn 54, Issue 3, 2001, Pages

  Ehlers, H ^a   Schlak, M ^a   Fischer, U H P ^a  

^a FRAUNHOFER HEINRICH HERTZ INSTITUTE   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED OPTOELECTRONICS; INTERFEROMETERS; LIGHT; MULTICHIP MODULES; OPTICAL FIBERS; OPTICAL INSTRUMENT LENSES; OPTICAL WAVEGUIDES; SEMICONDUCTING INDIUM PHOSPHIDE; SEMICONDUCTOR LASERS; TIME DIVISION MULTIPLEXING; WAVELENGTH DIVISION MULTIPLEXING;

MONOLITHICALLY INTEGRATED MACH ZEHNDER INTERFEROMETERS; MULTIFIBER CHIP COUPLING MODULES; SEMICONDUCTOR OPTICAL AMPLIFIERS; STANDARD MONOMODE FIBER;

OPTICAL COMMUNICATION;

EID: 0034827274     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. Monolithically integrated MZI comprising band gap shifted SOAs: A new switching scheme for generic all-optical signal processing
2. Monolithically integrated asymmetric Mach-Zehnder interferometer as a 20 Gbit/s all-optical add/drop multiplexer for OTDM applications
3. Monolithically integrated semiconductor laser amplifier based interferometers for optical signal processing
4. Integrated optics for high bitrate systems
5. Micropackaging technologies for optoelectronic components
6. Optoelectronic packaging
7. Laser micro welding and micro melting for connection of optoelectronic micro-components
8. Trends in laserpackaging
9. An automated fiber alignment, fixing and hermetic sealing system
10. Semiconductor laser to single-mode coupler