Development of 3-dimensional module package, "system block module"

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 552-557

  Imoto, T ^a   Matsui, M ^a   Takubo, C ^a   Akejima, S ^a   Kariya, T ^a   Nishikawa, T ^a   Enomoto, R ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; DYNAMIC RANDOM ACCESS STORAGE; FLASH MEMORY; FLIP CHIP DEVICES; INTERCONNECTION NETWORKS; MICROPROCESSOR CHIPS; PRINTED CIRCUIT BOARDS; THREE DIMENSIONAL;

MICRO FLIP CHIP BONDING; SILICON DEVICE THINNING; SYSTEM BLOCK MODULE; THREE DIMENSIONAL MODULE PACKAGE;

ELECTRONICS PACKAGING;

EID: 0034825918     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)

1. Multichip packages: New developments and applications