Thick film deposition by spin coating film transfer and hot-pressing

NTT R and D

Volumn 50, Issue 7, 2001, Pages 470-475

  Sato, N ^a   Machida, K ^a   Kyuragi, H ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; DIELECTRIC FILMS; HOT PRESSING; MICROELECTROMECHANICAL DEVICES; SILICON; SPIN COATING; SUBSTRATES; THICK FILMS; VACUUM APPLICATIONS;

SEAMLESS INTEGRATION TECHNOLOGY;

DEPOSITION;

EID: 0034825517     PISSN: 09152326     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)

1. LSI surface leveling by RF sputter etching
2. 2 planarization technology with biasing and electron cyclotron resonance plasma deposition for submicron interconnections
3. Application of chemical polishing to the fabrication of VLSI circuit interconnections
4. A spin-on-glass film treatment technology using a fluoroalkoxysilane vapor at room temperature
5. SOG non-etch-back process using perhydrosilazane for half-micron devices