Study of hardness and grain size in pulse current electroforming of nickel using different shaped waveforms

Journal of Applied Electrochemistry

Volumn 31, Issue 1, 2001, Pages 25-34

  Wong, K P ^a   Chan, K C ^a   Yue, T M ^a  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CURRENTS; ELECTROFORMING; GRAIN SIZE AND SHAPE; HARDNESS; MORPHOLOGY; NICKEL PLATING; RELAXATION PROCESSES; SCANNING ELECTRON MICROSCOPY; WAVEFORM ANALYSIS;

PULSE CURRENT ELECTROFORMING;

NICKEL;

EID: 0034823486     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1004120823907     Document Type: Article

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