Economic and logistical modeling for regional processing and recovery of engineering thermoplastics

IEEE International Symposium on Electronics and the Environment

Volumn , Issue , 2001, Pages 229-235

  Murphy, C F ^a   Dillon, P S ^a   Pitts, G E ^a  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC EQUIPMENT; INDUSTRIAL ECONOMICS; PROCESSING; RECYCLING;

ELECTRONIC PRODUCTS; LOGISTICAL MODELING; REGIONAL PROCESSING;

THERMOPLASTICS;

EID: 0034823004     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Recycling infrastructure for engineering thermoplastics: A supply chain analysis
2. Recycling market development for engineering thermoplastics from used electronic equipment: Summary report of the stakeholder dialogue meetings