Heterogeneous integration of OE arrays with Si electronics and micro-optics

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 864-869

  Liu, Y ^a  

^a HONEYWELL   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAYS; CHIP SCALE PACKAGES; DENSITY (OPTICAL); INTEGRATED OPTOELECTRONICS; LASERS; MICROOPTICS; OPTICAL DESIGN; PHOTODETECTORS; SEMICONDUCTING SILICON;

OPTICAL INTERCONNECT CAPACITY; OPTOELECTRONIC ARRAYS; PARALLEL OPTICAL INTERCONNECT; SMART PIXEL ARRAY; VERTICAL CAVITY SURFACE EMITTING LASERS;

OPTICAL INTERCONNECTS;

EID: 0034822799     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Commercialization of honeywell's VCSEL technology
2. High speed characteristics of VCSELs
3. VCSEL based modules for optical interconnects
4. 3D optoelectronic stacked processors
5. FAST-Net optical interconnection prototype demonstration
6. Integrated VCSELs, MSM photodetector, and GaAs MESFETs for low cost optical interconnects
7. Description and evaluation of the FAST-Net smart pixel-based optical interconnection prototype