An ambient-temperature adhesive bonded repair process for aluminum alloys

International SAMPE Symposium and Exhibition (Proceedings)

Volumn 46 I, Issue , 2001, Pages 1135-1147

  McCray, D B ^a   Huff, J M ^a   Smith, J A ^a   Mazza, J J ^a  

^a UNIVERSITY OF DAYTON RESEARCH INSTITUTE   (United States)

Author keywords

Adhesive bonding; Ambient temperature; Bonded repair; Paste adhesive; Sol gel; Surface preparation

Indexed keywords

ADHESIVE JOINTS; ADHESIVE PASTES; DURABILITY; SOL-GELS;

ADHESIVE BONDING;

ALUMINUM ALLOYS;

EID: 0034818427     PISSN: 08910138     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

1. Optimization of sol-gel surface preparations for repair bonding of aluminum alloys
2. Standard test method for apparent shear strength of single-lap-joint adhesively bonded metal specimens by tension loading (metal-to-metal)
3. Standard test method for floating roller peel resistance of adhesives
4. Standard guide for preparation of aluminum surfaces for structural adhesives bonding (phosphoric acid anodizing)
5. Repair techniques using Sol-gel surface preparations
6. Standard test method for adhesive-bonded surface durability of aluminum (wedge test)
7. EA 9394 and EA 9396 data package