Non-uniform chip-temperature dependent signal integrity

IEEE Symposium on VLSI Circuits, Digest of Technical Papers

Volumn , Issue TECHNOLOGY SYMP., 2001, Pages 145-146

  Ajami, A H ^a   Banerjee, K ^a   Pedram, M ^a  

^a University of Southern California   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC DELAY LINES; MATHEMATICAL MODELS; SUBSTRATES; TEMPERATURE DISTRIBUTION; THERMAL DIFFUSION; THERMAL EFFECTS;

CLOCK SKEW;

INTEGRATED CIRCUIT LAYOUT;

EID: 0034785052     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)