Microstructural differences in silicon nitrides with and without a small amount of TiN additive

Key Engineering Materials

Volumn 206-213, Issue II, 2001, Pages 1181-1184

  Duan, R G ^a   Roebben, G ^a   Sarbu, C ^a   Vleugels, J ^a   Van der Biest, O ^a  

^a UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

High Temperature X ray Diffraction (HTXRD); Impulse Excitation Technique (IET); Intergranular Glass Phase; Internal Friction; Silicon Nitride; Thermal Expansion

Indexed keywords

ADDITIVES; AMORPHOUS MATERIALS; CRYSTAL LATTICES; FRACTURE TOUGHNESS; SILICON NITRIDE; SINTERING; SOLID SOLUTIONS; THERMAL EXPANSION; TITANIUM NITRIDE; X RAY DIFFRACTION ANALYSIS;

INTERGRANULAR GLASS PHASES;

CERAMIC MATERIALS;

EID: 0034777816     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: None     Document Type: Conference Paper

References (11)