Low cost SiC/Si3N4 nanocomposites

Key Engineering Materials

Volumn 206-213, Issue II, 2001, Pages 1061-1064

  Hnatko, M ^a   Sajgalik P ^a   Lences Z ^a   Monteverde, F ^a   Dusza, J ^a   Warbichler, P ^a   Hofer, F ^a  

^a INSTITUTE OF CHEMISTRY   (Slovakia)

Author keywords

Creep resistance; Fracture toughness; Hardness; Nanocomposite; Silicon carbide; Silicon nitride

Indexed keywords

AMORPHOUS MATERIALS; FRACTURE TOUGHNESS; GRAIN SIZE AND SHAPE; HARDNESS; HIGH TEMPERATURE EFFECTS; REDUCTION; SILICON CARBIDE; SILICON NITRIDE; SINTERING;

CREEP RESISTANCE;

NANOSTRUCTURED MATERIALS;

EID: 0034772323     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: None     Document Type: Conference Paper

References (10)