Advanced statistical process control: Controlling sub- 0.18μm Lithography and other processes

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4344, Issue 1, 2001, Pages 312-322

  Zeidler, Amit ^a   Veenstra, Klaas Jelle ^a   Zavecz, Terrence E ^b  

^a NXP SEMICONDUCTORS   (Netherlands)

^b Yield Dynamics Inc   (United States)

Author keywords

Advanced process control; APC; CD; Critical dimensions; Feed forward; Lithography; Overlay; PPC; Predictive process control; Process control

Indexed keywords

CHEMICAL MECHANICAL POLISHING; DEPOSITION; PREDICTIVE CONTROL SYSTEMS; PROCESS CONTROL; SEMICONDUCTOR DEVICE MANUFACTURE;

ADVANCED PROCESS CONTROL (APC);

LITHOGRAPHY;

EID: 0034768503     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.436757     Document Type: Article

References (4)

1. Process control for sub 0.2 um lithography
2. Life beyond mix-and-match: Controlling sub-0.18 μm overlay errors
3. Statistical process monitoring and feedback adjustment - A discussion