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Volumn 215, Issue 8, 2001, Pages 883-892
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Damage mechanics characterization on the fatigue behaviour of a solder joint material
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Author keywords
Damage mechanics; Failure analysis; Fatigue; Solder material
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Indexed keywords
CRACK INITIATION;
CRACK PROPAGATION;
FAILURE ANALYSIS;
FATIGUE OF MATERIALS;
FINITE ELEMENT METHOD;
LOADS (FORCES);
MICROCRACKS;
VISCOPLASTICITY;
DAMAGE MECHANICS;
THERMOMECHANICAL FATIGUE (TMF) LOADING;
SOLDERED JOINTS;
DAMAGE;
FAILURE ANALYSIS;
FATIGUE;
SOLDER;
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EID: 0034763218
PISSN: 09544062
EISSN: None
Source Type: Journal
DOI: 10.1243/0954406011524252 Document Type: Article |
Times cited : (8)
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References (28)
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