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Volumn 51, Issue 1, 2001, Pages 63-71

Nondestructive detection of weak joints in adhesively bonded composite structures

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE STRUCTURES; DAMPING; MATHEMATICAL MODELS; NONDESTRUCTIVE EXAMINATION; STRUCTURAL ANALYSIS; VIBRATIONS (MECHANICAL);

EID: 0034746407     PISSN: 02638223     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0263-8223(00)00125-2     Document Type: Article
Times cited : (98)

References (7)
  • 2
    • 0029323888 scopus 로고
    • An overview of the basic aspects of polymer adhesion. Part I: Fundamentals
    • Fourche G. An overview of the basic aspects of polymer adhesion. Part I: fundamentals. Poly Eng Sci 1995;35(12):957-67.
    • (1995) Poly Eng Sci , vol.35 , Issue.12 , pp. 957-967
    • Fourche, G.1
  • 3
    • 0027092212 scopus 로고
    • Nondestructive application of damping measurements
    • Kinra VK, Wolfdnden A, editors. ASTM STP 1169 Philadelphia: American Society for Testing and Materials
    • 3D: mechanics and mechanisms of material damping, ASTM STP 1169. Philadelphia: American Society for Testing and Materials; 1992. p. 60-75.
    • (1992) 3D: Mechanics and Mechanisms of Material Damping , pp. 60-75
    • Gibson, R.F.1
  • 4
    • 84952415787 scopus 로고
    • The non-destructive testing of adhesively bonded structure: A review
    • Guyott CCH, Cawley P, Adams RD. The non-destructive testing of adhesively bonded structure: a review. J Adhesion 1986;20: 129-59.
    • (1986) J Adhesion , vol.20 , pp. 129-159
    • Guyott, C.C.H.1    Cawley, P.2    Adams, R.D.3
  • 5
    • 0026910665 scopus 로고
    • Nondestructive evaluation of adhesively bonded joints in graphite/epoxy composites using acousto-ultrasonics
    • Tanary S, Haddad YM, Fahr A, Lee S. Nondestructive evaluation of adhesively bonded joints in graphite/epoxy composites using acousto-ultrasonics. Trans ASME 1992; 114:344-52.
    • (1992) Trans ASME , vol.114 , pp. 344-352
    • Tanary, S.1    Haddad, Y.M.2    Fahr, A.3    Lee, S.4
  • 6
    • 0024639925 scopus 로고
    • Fast-cure epoxy bonds RP at lower fixture temperatures
    • April
    • Wongkamolsesh K. Fast-cure epoxy bonds RP at lower fixture temperatures. Adhesives age, April 1989, p. 30-3.
    • (1989) Adhesives Age , pp. 30-33
    • Wongkamolsesh, K.1
  • 7
    • 0032172293 scopus 로고    scopus 로고
    • Modal parameter analysis of degraded adhesively bonded composite beams by finite element numerical simulation
    • Yang S, Gibson RF, Gu L, Chen WH. Modal parameter analysis of degraded adhesively bonded composite beams by finite element numerical simulation. Composite Structures 1998;43:79-91.
    • (1998) Composite Structures , vol.43 , pp. 79-91
    • Yang, S.1    Gibson, R.F.2    Gu, L.3    Chen, W.H.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.