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Volumn 279, Issue 1-2, 2000, Pages 254-260

The model of crack propagation in polycrystalline copper at various propagating rates

Author keywords

Dislocation; Intergranular; Strain localization; Transgranular

Indexed keywords

COALESCENCE; CRACK PROPAGATION; DISLOCATIONS (CRYSTALS); FRACTURE TOUGHNESS; GRAIN BOUNDARIES; MATHEMATICAL MODELS; POLYCRYSTALLINE MATERIALS; STRAIN CONTROL;

EID: 0034728454     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(99)00635-8     Document Type: Article
Times cited : (10)

References (30)
  • 27
    • 85162771641 scopus 로고
    • E647-88a, ASTM, Philadelphia, PA
    • Annual book of ASTM Standards, E647-88a, ASTM, Philadelphia, PA, Vol. 0301, 1990, p. 649.
    • (1990) Annual Book of ASTM Standards , vol.301 , pp. 649
  • 28
    • 85162744341 scopus 로고    scopus 로고
    • Ph.D. thesis, Institute of Material Science, National Sun Yet-sen University
    • Huang, H.L., Ph.D. thesis, Institute of Material Science, National Sun Yet-sen University, 1997.
    • (1997)
    • Huang, H.L.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.