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Volumn 279, Issue 1-2, 2000, Pages 254-260
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The model of crack propagation in polycrystalline copper at various propagating rates
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Author keywords
Dislocation; Intergranular; Strain localization; Transgranular
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Indexed keywords
COALESCENCE;
CRACK PROPAGATION;
DISLOCATIONS (CRYSTALS);
FRACTURE TOUGHNESS;
GRAIN BOUNDARIES;
MATHEMATICAL MODELS;
POLYCRYSTALLINE MATERIALS;
STRAIN CONTROL;
BACKSCATTERED ELECTRON IMAGING;
DISLOCATION STRUCTURE;
FRACTURE SURFACE;
SECONDARY ELECTRON IMAGING;
TRANSGRANULAR;
COPPER;
COPPER;
CRACK PROPAGATION;
FATIGUE;
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EID: 0034728454
PISSN: 09215093
EISSN: None
Source Type: Journal
DOI: 10.1016/S0921-5093(99)00635-8 Document Type: Article |
Times cited : (10)
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References (30)
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