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Volumn 90, Issue 5, 2000, Pages 439-444

Electrical resistivity and electron structure of Ti-Ni and Ti-Cu based amorphous metallic alloys

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EID: 0034553204     PISSN: 0031918X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (4)

References (19)
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  • 4
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  • 6
    • 84996263556 scopus 로고
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    • Ziman, Y.M.1
  • 7
    • 84956239942 scopus 로고
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  • 8
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    • Cote, P.I.1
  • 9
    • 0028320147 scopus 로고
    • Thermal stability and relaxation processes of the Ti-Cu-and Ti-Ni-Based metallic glasses
    • Babich, N.G., Dashevsky, N.N., Nakonechna, O.I., Revo, S.L., and Zakharenko, N.I., Thermal Stability and Relaxation Processes of the Ti-Cu-and Ti-Ni-Based Metallic Glasses, MRS Symp. Proc., 1993, vol. 321, pp. 83-89.
    • (1993) MRS Symp. Proc. , vol.321 , pp. 83-89
    • Babich, N.G.1    Dashevsky, N.N.2    Nakonechna, O.I.3    Revo, S.L.4    Zakharenko, N.I.5
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  • 14
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    • (1969) Elektrony v Neuporyadochennykh Strukturakh
  • 15
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    • Berlin: Springer
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    • Madelung, O.1
  • 16
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  • 19
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    • Dorleijn, J.W.F.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.