Experimental study and modeling of microwave bond wire interconnects

IEEE Antennas and Propagation Society, AP-S International Symposium (Digest)

Volumn 4, Issue , 2000, Pages 2020-2023

  Sutono, A ^a   Cafaro, N G ^a   Laskar, J ^a   Tentzeris, E ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BALL CRESCENT WIRE BOND; MICROWAVE BOND WIRE INTERCONNECTS; WEDGE WIRE BOND;

CAPACITORS; COMPUTER SIMULATION; ELECTROMAGNETIC FIELD THEORY; EQUIVALENT CIRCUITS; INTEGRATED CIRCUIT MANUFACTURE; METHOD OF MOMENTS; MICROSTRIP LINES; MICROWAVE INTEGRATED CIRCUITS;

INTERCONNECTION NETWORKS;

EID: 0034548245     PISSN: 02724693     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)