Fabrication of micro optical components by high precision embossing

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4179, Issue 1, 2000, Pages 96-106

  Otto, T ^a   Schubert, A ^b   Boehm J ^b   Gessner, T ^a,c  

^a FRAUNHOFER IZM   (Germany)

^b FRAUNHOFER INSTITUTE FOR MACHINE TOOLS AND FORMING TECHNOLOGY IWU   (Germany)

^c CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Embossing of metals; Functional package; Optical grating; Silicon die; Spectrometer

Indexed keywords

DIFFRACTION GRATINGS; ELECTRONICS PACKAGING; MICROELECTROMECHANICAL DEVICES; PRECISION ENGINEERING; SEMICONDUCTING SILICON; SINGLE CRYSTALS; SURFACE ROUGHNESS;

FUNCTIONAL PACKAGES; HIGH PRECISION EMBOSSINGS; SILICON DIE;

MICROOPTICS;

EID: 0034543560     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.395679     Document Type: Article

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