Characterization of copper oxidation and reduction using spectroscopic ellipsometry

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4182, Issue 1, 2000, Pages 97-105

  Powell, Ron ^a   Settles, Derryck ^a   Lane, Larry ^a   Ygartua, Carlos ^b   Srivatsa, Arun ^b   Hayzelden, Clive ^b  

^a NOVELLUS SYSTEMS INC   (United States)

^b KLA TENCOR CORPORATION   (United States)

Author keywords

Copper; Ellipsometry; Microelectronics; Oxidation; Surface analysis

Indexed keywords

ADHESION; COPPER; DIELECTRIC FILMS; ELLIPSOMETRY; MICROELECTRONIC PROCESSING; MULTILAYERS; REDOX REACTIONS; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SPUTTER DEPOSITION;

SPECTROSCOPIC ELLIPSOMETRY; X RAY FLUORESCENCE;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0034541713     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.410065     Document Type: Article

References (0)