Single crystal micromachining using multiple fusion bonded layers

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4174, Issue 1, 2000, Pages 406-415

  Brown, A ^a   O'Neill, G ^a   Blackstone, S ^a  

^a BCO Technologies (NI) Ltd   (United Kingdom)

Author keywords

Buried cavities; Direct wafer bonding; DRIE; Fusion bonding; MEMS; MOEMS; Multi layer substrate; SOl

Indexed keywords

BONDING; INTERFACES (MATERIALS); MICROELECTROMECHANICAL DEVICES; MICROSCOPIC EXAMINATION; MULTILAYERS; SILICON; SILICON ON INSULATOR TECHNOLOGY; SINGLE CRYSTALS;

FUSION BONDING; INFRARED TRANSMISSION; MULTILAYER SUBSTRATES; SCANNING ACOUSTIC MICROSCOPY;

MICROMACHINING;

EID: 0034541675     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.396460     Document Type: Article

References (0)