Novel low-temperature pressure-assisted bonding technology

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4174, Issue , 2000, Pages 363-370

  Sayah, A ^a   Solignac, D ^a   Gijs, M A M ^a  

^a EPFL   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (CHEMICAL); ETCHING; GLASS; HIGH PRESSURE EFFECTS; MICROSTRUCTURE; SUBSTRATES; THERMAL EFFECTS;

MICROCHANNELS; POWDER BLASTING;

BONDING;

EID: 0034538665     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.396455     Document Type: Conference Paper

References (18)