Dimensional instability of cement bonded particleboard: SEM and image analysis

Journal of Materials Science

Volumn 35, Issue 24, 2000, Pages 6213-6220

  Fan, M Z ^a   Bonfield, P W ^a   Dinwoodie, J M ^a   Breese, M C ^b  

^a BUILDING RESEARCH ESTABLISHMENT   (United Kingdom)

^b BANGOR UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CEMENTS; IMAGE ANALYSIS; MOISTURE; SCANNING ELECTRON MICROSCOPY; STRAIN MEASUREMENT; STRESS ANALYSIS; THICKNESS MEASUREMENT;

CEMENT BONDED PARTICLEBOARDS (CBPB); DIMENSIONAL INSTABILITY;

PARTICLE BOARD;

EID: 0034514289     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1026733313070     Document Type: Article

References (11)

1. O. SUCHSLAND, Quart. Bull. Michigan Agric. Exp. Sta. Michigan State Univ. 45(1) (1962) 104.
2. O. SUCHSLAND and H. XU, For. Pro. J. 39(5) (1989) 29.
3. C. DAI and P. R. STEINER, Wood Sci. Technol. 28 (1994) 135.
4. Idem., ibid. 28 (1994) 229.
5. D. C. STAH, Wood and Fibre Sci. 29(4) (1997) 345.
6. C. A. LENTH and F. A. KAMKE, ibid. 28(2) (1996) 153.
7. M. Z. FAN, J. M. DINWOODIE, P. W. BONFIELD and M. C. BREESE, J. Mater. Sci. 34 (1999) 1729.
8. Idem., Wood Sci. Technol., in press.
9. Idem., ibid., in press.
10. Idem., ibid., in press.
11. M. Z. FAN, Doctorate Thesis, University of Wales, 1997.