Low temperature Co-fired Ceramic on Metal (LTCC-M) packaging technology

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2000, Pages 261-264

  Fathy, A ^a   McGinty, F ^a   Pendrick, V ^a   Ayers, G ^a   Geller, B ^a   Narayan, Y ^a   Thaler, B ^a   Chen, H D ^a   Liberatore, M J ^a  

^a SARNOFF CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERMETS; COMPUTER AIDED DESIGN; COMPUTER SIMULATION; EMBEDDED SYSTEMS; MATHEMATICAL MODELS; MULTILAYERS; TRANSMISSION LINE THEORY; WAVEFORM ANALYSIS;

FULL WAVE ANALYSIS;

ELECTRONICS PACKAGING;

EID: 0034512302     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (6)