Plasma damage evaluation of an integrated in-situ directional resist stripping process in magnetically enhanced RIE etcher for dual damascene application

International Symposium on Plasma Process-Induced Damage, P2ID, Proceedings

Volumn , Issue , 2000, Pages 113-116

  Ma, Shawming ^a   Dahimene, Mahmoud ^a   Bjorkman, Claes ^a   Shan, Hongchin ^a   Ramanathan, Ravi ^a  

^a Applied Materials   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL REACTORS; COPPER; DIELECTRIC MATERIALS; OXYGEN; PERFORMANCE; PLASMA ETCHING; PRESSURE; REACTIVE ION ETCHING; STRIPPING (REMOVAL);

DUAL DAMASCENE APPLICATIONS; IN SITU DIRECTIONAL RESIST STRIPPING PROCESS; NITRIDE SHIELDING; PLASMA DAMAGE;

PLASMA APPLICATIONS;

EID: 0034510713     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (4)