Study of heatsink grounding schemes for GHz microprocessors

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2000, Pages 189-192

  Radhakrishnan, Kaladhar ^a   Wittwer, David ^a   Li, Yuan Li,ang ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC CURRENTS; ELECTRIC GROUNDING; NATURAL FREQUENCIES;

HEATSINK;

MICROPROCESSOR CHIPS;

EID: 0034510656     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (6)